| Images | Part Number | Manufacturer | Stock | Package | Description | Inquiry | 
|---|---|---|---|---|---|---|
|   | 8349TFM-25ML | MG Chemicals | 2,595 | THERMAL ADHESIVE 25ML | Inquiry Now | |
|   | 65-00-TC50-0010 | Parker Chomerics | 3,111 | THERM-A-GAP TC50 5.2W/M-K 10CC | Inquiry Now | |
|   | 8329TFS-50ML | MG Chemicals | 2,771 | SLOW CURE THERM COND ADH FLOW | Inquiry Now | |
|  | A17170-01 | Laird Technologies - Thermal Materials | 3,521 | TPUTTY 508 | Inquiry Now | |
|   | 1379310 | LOCTITE | 4,294 | CATALYST 9 (27G) | Inquiry Now | |
|   | 65-02-GEL75-0030 | Parker Chomerics | 1,907 | THERM-A-GAP GEL 75 7.5 W/M-K DIS | Inquiry Now | |
|  | TG-NSP25-60 | t-Global Technology | 3,652 | SILICONE FREE THERMAL PUTTY 60CC | Inquiry Now | |
|   | 1978-1 | Techspray | 3,542 | SILICONE FREE HEAT SINK | Inquiry Now | |
|   | 832TC-450ML | MG Chemicals | 1,754 | THERMALLY CONDUCTIVE EPOXY | Inquiry Now | |
|   | 65-00-T670-0080 | Parker Chomerics | 1,143 | T670 3W/M-K GREASE 80CC JAR | Inquiry Now | |
|   | TG-N909-1000 | t-Global Technology | 2,526 | NON-SILICONE THERMAL GREASE 1KG | Inquiry Now | |
|  | 1586134 | LOCTITE | 3,883 | ECCOBOND 56C-CAT 9 KIT, 140.5GM | Inquiry Now | |
|   | TC3-10G | Chip Quik Inc. | 3,456 | HEAT SINK THERMAL COMPOUND | Inquiry Now | |
|   | 65-00-T630-0300 | Parker Chomerics | 3,583 | THERM-A-GAP T630 0.7W/M-K 300CC | Inquiry Now | |
|   | P0200-19 | Littelfuse Inc. | 7,784 | HEAT SINK COMP. SARAN PKG 2GR | Inquiry Now | |
|   | HSC67-6G | CAIG Laboratories, Inc. | 5,201 | SILICONE HEAT SINK COMPOUND SQUE | Inquiry Now | |
|   | TC3-1G | Chip Quik Inc. | 7,655 | HEAT SINK THERMAL COMPOUND | Inquiry Now | |
|  | TC1-10G | Chip Quik Inc. | 7,670 | HEAT SINK COMPOUND - HIGH DENSIT | Inquiry Now | |
|  | BT-102-50M | Wakefield-Vette | 4,851 | TOUGHENED, FLEXIBLE ADHESIVE SYS | Inquiry Now | |
|  | BT-101-50M | Wakefield-Vette | 4,885 | NON-SAG 5 MINUTE BONDATHERM EPOX | Inquiry Now | 
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